Mazuva ano, iyo yakakurumbira nharembozha skrini maitiro ine COG, COF neCOP, uye vanhu vazhinji vangasaziva mutsauko, saka nhasi ndichatsanangura mutsauko uripo pakati peaya maitiro matatu:

COP inomirira kuti "Chip On Pi", Musimboti weCOP screen packaging ndeyekupeta zvakananga chikamu chechidzitiro, nekudaro zvichiwedzera kudzikisa muganho, unogona kuwana pedo-bezel-isina maitiro.Nekudaro, nekuda kwekudiwa kwekupeta skrini, modhi dzinoshandisa COP screen packaging process dzinoda kuve neOLED flexible screens.Semuyenzaniso,Iphone x inoshandisa maitiro aya.

COG inomirira "Chip On Glass" .Iri pari zvino ndiyo yakajairika nzira yekuisa skrini, asiwo mhinduro inodhura zvakanyanya, inoshandiswa zvakanyanya.Chidzitiro chakazara chisati chagadzira chimiro, nharembozha dzakawanda dziri kushandisa COG screen packaging process, nekuti iyo chip inoiswa zvakananga pamusoro pegirazi, saka chiyero chekushandisa chenhare mbozha nzvimbo yakadzikira, uye chikamu chescreen hachina kukwirira.

COF inomirira kuti "Chip On Film".This screen packaging process ndeyekubatanidza IC chip yechidzitiro paFPC yechinhu chinochinjika, wobva wainamira pasi pechidzitiro, chinogona kuwedzera kuderedza muganhu uye kuwedzera screen chikamu chichienzaniswa neCOG mhinduro.

Pakazere, zvinogona kugumiswa kuti: COP > COF > COG, COP package ndiyo yakanyanya kufambira mberi, asi mutengo weCOP uriwo wepamusoro, uchiteverwa neCOP, uye pakupedzisira ndiyo yakanyanya hupfumi COG.Munguva ye-yakazara-screen nharembozha, iyo skrini chikamu kazhinji ine hukama hukuru neiyo skrini yekurongedza maitiro.